Velcro Buffer Fine - Rotary D.175-180 Each

This Family Of Polishing Pads Has Been Specifically Optimized For Rotary Polishers. The System Includes 3 Types Of Sponge Pads With An Exclusie Design, Each Designed To Offer The Operator A Choice Based On The Desired Result. The Open-Cell Sponge Structure Has Been Chosen To Maximize Heat Dissipation. The Pad Profile Helps Preent Accidental Contact Between The Backing Plate And The Panel Being Polished. All Pads In The Series Hae A Thickness Of 25 mm And Are Aailable For Backing Plates With Diameters Of 125 mm, 150 mm, And 180 mm. Yellow Fine Sponge Pads They Eliminate Moderate Defects And Scratches While Restoring A High Leel Of Gloss. The New Sponge Structure Ensures A Comfortable And Satisfying Polishing Experience.